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| Part: 40TS20-D6-SMT-S |
1 of 3 |
News Flash |
| Products: |
Breadboarding-adapters-TSOP |
| Package-type: |
TSOP-Type-1 |
| Package-pin-count: |
40-pins |
| Package-tip-to-tip: |
20.0mm |
| Package-pin-pitch: |
0.5mm |
| Adapter-DIP-plug: |
600-mils |
| Indexed: |
01-01-2000 |
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| Description: No longer available, use 40TS2014-D6-SMT-S which can accept 14.0mm as well as 20.0mm packages. |
| [Photos] |
| Part: 40TS2014-D6-SMT-S |
2 of 3 |
News Flash |
| Products: |
Breadboarding-adapters-TSOP |
| Package-type: |
TSOP-Type-1 |
| Package-pin-count: |
40-pins |
| Package-tip-to-tip: |
14.0-and-20.0mm |
| Package-pin-pitch: |
0.5mm |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$20.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: 40-TSOP Type 1 breadboarding (also incorrectly called prototyping) adapter converts 14.0mm and 20.0mm TSOP SMT packages to a 600-mil DIP component which can inserted into a DIP socket in place of the same device in a DIP package. The adapter has pads for 20.0mm tip-to-tip, as well as 14.0mm tip-to-tip TSOP packages. The TSOP parts are soldered to the SMT pads. DIP pin 1 is connected to TSOP pin 11 and DIP pin 40 is connected to TSOP pin 10. This is called wiring one-to-one because TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package. (Most devices in 28, 32 and 40-lead TSOP packages are also available in DIP packages.) For adapters with TSOP pin 1 going to DIP pin 1, see correction adapters (incorrect pin assignment). Suitable for hand soldering or infrared reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 44TST2-40D6-SMT-S |
3 of 3 |
News Flash |
| Products: |
Breadboarding-adapters-TSOP |
| Package-type: |
TSOP-type-2 |
| Package-pin-count: |
40-pins |
| Package-pin-pitch: |
0.8mm |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$22.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: 44-TSOP Type 2 SMT package conversion to 40-pin 600-mil DIP component. Two center leads on each side of the TSOP package are not connected to DIP pins. Designed for semiconductor memories in TSOP Type 2 packages. Suitable for hand soldering or infraded reflow soldering. |
| [Photos] |
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