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| Part: 32TS20-D6-SMT-S |
1 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-TSOP |
| Package-type: |
TSOP-Type-1 |
| Package-pin-count: |
32-pins |
| Package-tip-to-tip: |
20.0mm |
| Package-pin-pitch: |
0.5mm |
| Adapter-DIP-plug: |
600-mils |
| Indexed: |
01-01-2000 |
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| Description: No longer available, use 32TS2014-D6-SMT-S which can accept 14.0mm as well as 20.0mm packages. |
| Part: 32TS2014-D6-SMT-S |
2 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-TSOP |
| Package-type: |
TSOP-Type-1 |
| Package-pin-count: |
32-pins |
| Package-tip-to-tip: |
14.0-and-20.0mm |
| Package-pin-pitch: |
0.5mm |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$16.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: 32-TSOP Type 1 breadboarding (also incorrectly called prototyping) adapter converts 14.0mm and 20.0-mm TSOP SMT packages to a 600-mil DIP component which can inserted into a DIP socket in place of the same device in a DIP package. The adapter has pads for 20.0mm tip-to-tip, as well as 14.0mm tip-to-tip TSOP packages. The TSOP parts are soldered to the SMT pads. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8. This is called wiring one-to-one because TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package. (Most devices in 28, 32 and 40-lead TSOP packages are also available in DIP packages.) For adapters with TSOP pin 1 going to DIP pin 1, see correction adapters (incorrect pin assignment). Suitable for hand soldering or infrared reflow soldering. |
| [Adapter-drawings|Photos] |
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