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| Part: 24SO-D3-SMT-S |
1 of 4 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: Breadboarding adapter for 24-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
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| [Adapter-drawings|Photos] |
| Part: 24SO-D6-SMT-S |
2 of 4 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Body-width: |
550-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-510-mils |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 24-lead SOIC packages converts an SOIC SMT package into a 600-mil DIP component. The SOIC parts are soldered to the pads. The adapter has pads for SOIC packages with up to 330 mil body width. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
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| [Adapter-drawings|Photos] |
| Part: 24SO-D6-SMT-S-COH |
3 of 4 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Body-width: |
550-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
300-700-mils |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for very wide 24-lead SOIC packages converts an SOIC SMT package into a 600-mil DIP component. The SOIC parts are soldered to the pads. The adapter has pads for SOIC packages with up to 550 mil body width and pads for two DECOUPLING CAPACITORS. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Photos] |
| Part: 24SO-D6-SMT-S-OH |
4 of 4 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Body-width: |
550-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
300-700-mils |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for very wide 24-lead SOIC packages converts an SOIC SMT package into a 600-mil DIP component. The SOIC parts are soldered to the pads. The adapter has pads for SOIC packages with up to 550 mil body width. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Photos] |
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