| Part: 18SO-D3-SMT-S |
1 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
18-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$9.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 18-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 18-350000-10, 18-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9RS0KA8, MC68HC908QC4, MC68HC908QC8, PIC16F54, PIC16F87, PIC16F88, PIC16F627A, PIC16F628A, PIC16F648, PIC16F716, PIC16F818, PIC16F819, PIC18F1220, PIC18F1320, PIC24HJ12GP201, dsPIC30F2011, dsPIC30F3012, dsPIC33FJ12GP201, PIC16C433 |
| Manfs.: Microchip Technology |
|
| [Adapter-drawings|Photos] |
| Part: 18SO-D6-SMT-S |
2 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
18-pins |
| Body-width: |
550-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-510-mils |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$9.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 18-lead SOIC packages converts an SOIC SMT package into a 600-mil DIP component. The adapter has pads for SOIC packages with up to 330 mil body width. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
|
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