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| Part: 6SO-D3-SMT-S |
1 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
6-pins |
| Body-width: |
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| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
125-373-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$3.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: Breadboarding adapter for 6-lead SOIC packages converts an SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 8SO-D3-SMT-S |
2 of 2 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
8-pins |
| Body-width: |
|
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
125-373-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$4.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 8-lead SOIC packages converts an SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
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| [Adapter-drawings|Photos] |
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