| Part: 14SO-D3-SMT-S |
1 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
14-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$7.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 14-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
|
| [Adapter-drawings|Photos] |
| Part: 14SO15-D3-SMT-S |
2 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
14-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
244-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$7.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for narrow (153-mil wide body) 14-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 16SO-D3-SMT-S |
3 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
16-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$8.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 16-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
|
| [Adapter-drawings|Photos] |
| Part: 16SO15-D3-SMT-S |
4 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
16-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
244-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$8.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for narrow (153-mil wide body) 16-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 18SO-D3-SMT-S |
5 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
18-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$9.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 18-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
|
| [Adapter-drawings|Photos] |
| Part: 20SO-D3-SMT-S |
6 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
20-pins |
| Body-width: |
300-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$10.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 20-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 20-350000-10, 20-350001-10, 20-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S06SH4, MC9S06SH8, MC68HC908QC4, MC68HC908QC8, SC9RSO8MZ8 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 24SO-D3-SMT-S |
7 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 24-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
|
| [Adapter-drawings|Photos] |
| Part: 28SO-D3-SMT-S |
8 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
28-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$14.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 28-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 28-350002-10, 28-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RG32, MC9S08RG60, MC9S06SH16, MC9S06SH32, MC68HC908QC, MC68HC908QC8 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 32SO-D3-SMT-S |
9 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
32-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$16.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 32-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 6SO-D3-SMT-S |
10 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
6-pins |
| Body-width: |
|
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
125-373-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$3.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 6-lead SOIC packages converts an SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
|
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