| Part: 14SO-D3-SMT-S |
1 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
14-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$7.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 14-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 14-350000-10, 14-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: PIC12F506, PIC16F506, PIC16F526, PIC16F610, PIC16HV610, PIC16F616, PIC16HV616, PIC16F630, PIC16F636, PIC16F676, PIC16F684, PIC16F688 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 14SO15-D3-SMT-S |
2 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
14-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
244-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$7.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for narrow (153-mil wide body) 14-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 16SO-D3-SMT-S |
3 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
16-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$8.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 16-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 16-350000-10, 16-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: PIC12F506, PIC16F506, PIC16F526, PIC16F610, PIC16HV610, PIC16F616, PIC16HV616, PIC16F630, PIC16F636, PIC16F676, PIC16F684, PIC16F688 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 16SO15-D3-SMT-S |
4 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
16-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
244-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$8.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for narrow (153-mil wide body) 16-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Microprocessors: PIC12F506, PIC16F506, PIC16F526, PIC16F610, PIC16HV610, PIC16F616, PIC16HV616, PIC16F630, PIC16F636, PIC16F676, PIC16F684, PIC16F688 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 18SO-D3-SMT-S |
5 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
18-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$9.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 18-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 18-350000-10, 18-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9RS0KA8, MC68HC908QC4, MC68HC908QC8, PIC16F54, PIC16F87, PIC16F88, PIC16F627A, PIC16F628A, PIC16F648, PIC16F716, PIC16F818, PIC16F819, PIC18F1220, PIC18F1320, PIC24HJ12GP201, dsPIC30F2011, dsPIC30F3012, dsPIC33FJ12GP201, PIC16C433 |
| Manfs.: Microchip Technology |
|
| [Adapter-drawings|Photos] |
| Part: 20SO-D3-SMT-S |
6 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
20-pins |
| Body-width: |
300-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-460-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$10.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 20-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 20-350000-10, 20-350001-10, 20-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S06SH4, MC9S06SH8, MC68HC908QC4, MC68HC908QC8, SC9RSO8MZ8 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |
| Part: 24SO-D3-SMT-S |
7 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
24-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$12.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 24-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
|
| [Adapter-drawings|Photos] |
| Part: 28SO-D3-SMT-S |
8 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
28-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$14.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 28-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 28-350002-10, 28-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RG32, MC9S08RG60, MC9S06SH16, MC9S06SH32, MC68HC908QC, MC68HC908QC8, PIC14000, PIC16F57, PIC16F72, PIC16F73, PIC16F76, PIC16F87, PIC16F88, PIC16F627A, PIC16F628A, PIC16F648, PIC16F722, PIC16LF722, PIC16F723, PIC16LF723, PIC16F726, PIC16LF726, PIC16F737, PIC16F767, PIC16F818, PIC16F819, PIC16F870, PIC16F872, PIC16F882, PIC16F883, PIC16F886, PIC16F913, PIC16F916, PIC16F1933, PIC16LF1933, PIC16F1936, PIC16LF1936, PIC16F1938, PIC16LF1938, PIC18F1220, PIC18F1320, PIC18F2220, PIC18F2221, PIC18F2320, PIC18F2321, PIC18F2331, PIC18F2410, PIC18F2420, PIC18F2423, PIC18F2431, PIC18F2450, PIC18F2455, PIC18F2458, PIC18F2480, PIC18F2510, PIC18F2515, PIC18F2520, PIC18F2523, PIC18F2525, PIC18F2550, PIC18F2553, PIC18F2580, PIC18F2585, PIC16F2610, PIC18F2620, PIC18F2680, PIC18F2682, PIC18F2685, PIC18F23K20, PIC18F24K20, PIC18F25K20, PIC18F26K20, PIC18F24J10, PIC18F25J10, PIC24FJ16GA002, PIC24FJ32GA002, PIC24FJ48GA002, PIC24FJ64GA002, PIC24HJ12GP202, PIC24HJ32GP202, PIC24HJ32GP302, PIC24HJ64GP202, PIC24HJ64GP502, PIC24HJ128GP202, PIC24HJ128GP502, dsPIC30F1010, dsPIC30F2010, dsPIC30F2012, dsPIC30F2020, dsPIC30F3010, dsPIC30F3013, dsPIC30F4012, dsPIC33FJ12GP202, dsPIC33FJ12MC202, dsPIC33FJ32GP202, dsPIC33FJ32GP302, dsPIC33FJ32MC202, dsPIC33FJ32MC302, dsPIC33FJ64GP202, dsPIC33FJ64GP802, dsPIC33FJ64MC302, dsPIC33FJ64MC802, dsPIC33FJ128GP202, dsPIC33FJ128GP802, dsPIC33FJ128MC302, dsPIC33FJ128MC802 |
| Manfs.: Microchip Technology |
|
| [Adapter-drawings|Photos] |
| Part: 32SO-D3-SMT-S |
9 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
32-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$16.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 32-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
| Part: 6SO-D3-SMT-S |
10 of 11 |
News Flash |
| Products: |
Breadboarding-adapters-SOIC |
| Package-type: |
SOIC |
| Package-pin-count: |
6-pins |
| Body-width: |
|
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
125-373-mils |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$3.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 6-lead SOIC packages converts an SMT package into a 300-mil DIP component. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| [Adapter-drawings|Photos] |
|
smt-adapter.biz 
