| Product: Breadboarding-adapters-SOIC |
Part: 28SO-D3-SMT-S |
| Package-type: |
SOIC |
| Package-pin-count: |
28-pins |
| Package-pin-pitch: |
50-mil |
| Adapter-DIP-plug: |
300-mils |
| Price: |
$14.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
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| Description: Breadboarding adapter for 28-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The SOIC parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Cross-Reference: 28-350002-10, 28-35W00-10 |
| Manfs.: Aries Electronics |
| Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RG32, MC9S08RG60, MC9S06SH16, MC9S06SH32, MC68HC908QC, MC68HC908QC8 |
| Manfs.: |
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| [Adapter-drawings|Photos] |
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