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Product: Breadboarding-adapters-SOIC Part: 20SO-D3-SMT-S
Package-type: SOIC
Package-pin-count: 20-pins
Body-width: 300-mils-max
Package-pin-pitch: 50-mil
Adapter-pads-tip-to-tip-range: 140-460-mils
Adapter-DIP-plug: 300-mils
Price: $10.00
Availability: stock
Indexed: 01-01-2000
Description: Breadboarding adapter for 20-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering.
Cross-Reference: 20-350000-10, 20-350001-10, 20-35W00-10
Manfs.: Aries Electronics
Microprocessors: MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RD16, MC9S06SH4, MC9S06SH8, MC68HC908QC4, MC68HC908QC8, SC9RSO8MZ8
Manfs.:
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