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Product: Breadboarding-adapters-SOIC Part: 18SO-D3-SMT-S
Package-type: SOIC
Package-pin-count: 18-pins
Package-pin-pitch: 50-mil
Adapter-DIP-plug: 300-mils
Price: $9.00
Availability: stock
Indexed: 01-01-2000
Description: Breadboarding adapter for 18-lead SOIC packages converts an SOIC SMT package into a 300-mil DIP component. The adapter has pads for SOIC packages with up to 300 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering.
Cross-Reference: 18-350000-10, 18-35W00-10
Manfs.: Aries Electronics
Microprocessors: MC9RS0KA8, MC68HC908QC4, MC68HC908QC8
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