| Product: Breadboarding-adapters-SOIC |
Part: 16SO-D6-SMT-S |
| Package-type: |
SOIC |
| Package-pin-count: |
16-pins |
| Body-width: |
550-mils-max |
| Package-pin-pitch: |
50-mil |
| Adapter-pads-tip-to-tip-range: |
140-510-mils |
| Adapter-DIP-plug: |
600-mils |
| Price: |
$8.00 |
| Availability: |
stock |
| Indexed: |
01-01-2000 |
|
|
| Description: Breadboarding adapter for 16-lead SOIC packages converts an SOIC SMT package into a 600-mil DIP component. The adapter has pads for SOIC packages with up to 330 mil body width. The parts are soldered to the pads. The adapter is wired one-to-one between SOIC pads and DIP pins. Suitable for hand soldering or infraded reflow soldering. |
| Microprocessors: MC9RS0KA8, MC68HC908QC4, MC68HC908QC8 |
| Manfs.: |
|
| [Adapter-drawings|Photos] |